Memory

When Micron announced plans to build two new fabs in the U.S. in 2022, the company vaguely said both would come online by the decade's end. Then, in 2023, it began to optimize its spending, which pushed production at these fabrication facilities. This week, the company outlined more precise timeframes for when its fabs in Idaho and New York will start operations: this will happen from calendar 2026 to calendar 2029. "These fab construction investments are necessary to support supply growth for the latter half of this decade," a statement by Micron in its Q3 FY2024 financial results report reads. "This Idaho fab will not contribute to meaningful bit supply until fiscal 2027 and the New York construction capex is not expected to contribute to...

SMART Modular Shows Off 256 GB Gen-Z Memory Module

SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...

15 by Anton Shilov on 8/15/2019

SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators

SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...

23 by Ryan Smith on 8/12/2019

Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea

Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...

16 by Anton Shilov on 8/9/2019

Microchip Announces DRAM Controller For OpenCAPI Memory Interface

Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...

17 by Billy Tallis on 8/5/2019

Western Digital: Nearly All NAND Capacities Resumed Normal Operations

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...

31 by Anton Shilov on 8/1/2019

G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000

G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14...

10 by Anton Shilov on 8/1/2019

Thermaltake’s Launches Liquid-Cooled WaterRam RGB DDR4-3600 Kits

Seemingly intent on proving that everything in a PC should in fact be liquid cooled, Thermaltake this week has expanded its WaterRAM lineup of water-cooled RAM with DDR4-3600 kits. Available...

18 by Anton Shilov on 8/1/2019

32 GB Unbuffered DIMMs Listed from Ten Brands: DDR4-2400 to DDR4-4000

Now that both Samsung and Micron are shipping their 16 Gb DDR4 memory chips to third parties, we're seeing wider availability of 32 GB unbuffered memory modules (UDIMMs). To...

12 by Anton Shilov on 7/31/2019

SK Hynix NAND Update: 3D NAND Output Cut, Slowdown Capacity Expansions

SK Hynix said that it would cut wafer starts of 3D NAND in the coming months more aggressively than it originally anticipated earlier this year. Besides, the company will...

14 by Anton Shilov on 7/26/2019

LG Display & SK Hynix Looking to Diversify Industrial Suppliers as Row with Japan Intensifies

South Korean electronics companies reaffirmed this week that production of computer memory and displays could be disrupted because of ongoing trade dispute between the country and Japan. Both SK...

8 by Anton Shilov on 7/26/2019

Corsair Unveils 32 GB Vengeance LPX DDR4 DIMMs, 64 GB & 128 GB Dual-Channel Kits

Corsair has introduced its first 32 GB unbuffered DRAM modules along with 64 GB and 128 GB dual-channel memory kits for mainstream PC platforms based on AMD’s 400/500-series as...

19 by Anton Shilov on 7/19/2019

Samsung Starts Production of LPDDR5-5500 Devices: 12 GB of DRAM in a Smartphone

Samsung has kicked off volume production of its LPDDR5 memory devices and intends to start mass assembly of memory packages based on the new DRAMs. The company’s LPDDR5 memory...

15 by Anton Shilov on 7/18/2019

Patriot Unveils Viper 4 Blackout: Compatible with Ryzen 3000, Up to DDR4-4000

Patriot has expanded its memory offerings for enthusiasts with a brand-new family of products, the Viper 4 Blackout. The new lineup supports data transfer rates of up to 4000...

15 by Anton Shilov on 7/11/2019

G.Skill Launches Trident Neo Memory Modules for AMD Ryzen 3000 CPUs

After every major CPU launch leading suppliers of memory modules release DIMMs validated to work with the new platform. This time around G.Skill not only announced DRAM modules that...

23 by Anton Shilov on 7/10/2019

Supply of DRAM, NAND & Displays Could Be Disrupted by Japan & South Korea Dispute

South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese...

39 by Anton Shilov on 7/5/2019

Fourth Chinese DRAM Company Established by Tsinghua Unigroup

After the U.S. Department of Commerce banned U.S. exports to Chinese Fujian Jinhua Integrated Circuit Company (also known as Fujian or JHICC), essentially destroying this maker of memory, it...

35 by Anton Shilov on 7/2/2019

Toshiba & WD NAND Production Hit By Power Outage: 6 Exabytes Lost

Toshiba Memory and Western Digital on Friday disclosed that an unexpected power outage in the Yokkaichi province in Japan on June 15 affected the manufacturing facilities that are jointly...

150 by Anton Shilov on 6/28/2019

Micron’s DRAM Update: More Capacity, Four More 10nm-Class Nodes, EUV, 64 GB DIMMs

During its earnings conference call with investors and financial analysts earlier this week, Micron expressed confidence in its long-term future and strong demand for its products as new applications...

23 by Anton Shilov on 6/28/2019

SK Hynix Starts Production of 128-Layer 4D NAND, 176-Layer Being Developed

SK Hynix has announced it has finished development of its 128-layer 1 terabit 3D TLC NAND flash. The new memory features the company’s charge trap flash (CTF) design, along...

28 by Anton Shilov on 6/26/2019

Silicon Power Goes Gaming: Unleashing XPower Turbine RGB Memory & SSDs

Silicon Power is best known for its reasonably-priced storage devices as well as various accessories for PCs and smartphones. But in an attempt to grow further, the company recently...

17 by Anton Shilov on 6/24/2019

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